Introduction

The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BiCS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.

BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.

The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.

Features

NVMe version

1.2.1

SSD form factor

M.2

SSD capacity

128 GB

Interface

PCI Express 3.1

Memory type

TLC

NVMe

Y

Component for

Notebook

Hardware encryption

N

Read speed

1300 MB/s

Write speed

600 MB/s

Power

Operating voltage

3.3 V

Power consumption (read)

3.2 W

Power consumption (write)

3.2 W

Operational conditions

Operating temperature (T-T)

0 - 80 °C

Storage temperature (T-T)

-40 - 85 °C

Weight & dimensions

Width

22 mm

Depth

30 mm

Height

2.38 mm

Weight

2.6 g